The **ATS-19B-28-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the high-performance **maxiFLOW™** series of heat sinks designed for cooling semiconductors. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | maxiFLOW™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54mm x 54mm x 15mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | ~6.57° C/W (at 200 LFM) | | **RoHS Status** | Compliant | --- ## 2. Component Breakdown The ATS-19B-28-C2-R0 is not just a block of metal; it is an engineered thermal management solution consisting of three main electronic/mechanical parts: ### A. The Heat Sink Body * **Design:** It features a flared fin structure. Unlike straight-fin heat sinks, flared fins increase the surface area and improve airflow performance in high-velocity systems. * **Material:** Made from aluminum for a balance of weight, thermal conductivity, and cost. The blue anodized finish provides corrosion resistance and slightly improves emissivity. ### B. The Attachment Mechanism (pushPIN™) * Instead of using thermal tape or glue, this part uses a **pushPIN™** system. * It consists of a brass or plastic pin with a stainless steel spring. * **Benefit:** This ensures consistent pressure on the processor/chip, which maximizes heat transfer (Thermal Interface Material performance) and allows for easy re-work or replacement. ### C. Thermal Interface Material (TIM) * The "-R0" suffix typically indicates that the part comes with **T766 phase change material** or a similar pre-applied thermal pad on the base. * This fills the microscopic air gaps between the electronic component (CPU/FPGA) and the heat sink. --- ## 3. Applications in Electronics This specific size and thermal profile are commonly used for: * **ASICs and FPGAs:** Used in networking hardware and telecommunications. * **Processors:** Cooling of mid-range CPUs or embedded controllers. * **Power Supplies:** Heat dissipation for high-current voltage regulators. --- ## 4. Part Number Decoder | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **19B** | Specific series/model identifier | | **28** | Length/Width identifier (approximate) | | **C2** | Thermal performance/Fin configuration code | | **R0** | Revision / Standard Packaging and TIM application | ---