Motore di ricerca datesheet componenti elettronici
  Italian  ▼
ALLDATASHEETIT.COM

X  

  • ATS-19E-65-C2-R0

  • AI
    ## Technical Overview: ATS-19E-65-C2-R0 The **ATS-19E-65-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **blueICE™** series, designed for cooling high-power electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Key Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 7.29°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | | **Compliance** | RoHS Compliant | --- ### 2. Component Design Breakdown #### A. The pushPIN™ Attachment System One of the defining "electronic parts" of this assembly is the mounting hardware. Unlike adhesive tapes, the **pushPIN™** system uses: * **Plastic/Brass Pins:** To secure the sink through pre-drilled holes in the PCB. * **Compression Springs:** These ensure a precise and consistent pressure (Total Force) is applied to the electronic chip, maximizing thermal transfer without cracking the silicon die. #### B. Thermal Interface Material (TIM) The "C2" designation typically refers to the **T766 thermal phase-change material** or a high-performance thermal pad pre-applied to the base. This acts as the bridge between the electronic component and the aluminum fins, filling microscopic air gaps. #### C. Fin Geometry * **Cross-Cut/Straight Fin:** The "65" in the part number identifies a specific fin configuration. The straight fin design is optimized for **undirected airflow**, allowing air to move through the sink from multiple angles, which is common in dense server or networking enclosures. --- ### 3. Application Use Cases This part is commonly integrated into the following electronic systems: 1. **Telecommunications:** Cooling line cards and signal processors. 2. **Embedded Computing:** High-heat industrial PCs. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators. --- ### 4. Part Number Decoder Understanding the "Electronic DNA" of the part: * **ATS:** Advanced Thermal Solutions (Brand). * **19E:** Series/Family type. * **65:** Specific fin count/spacing configuration. * **C2:** Thermal Interface Material (TIM) type and color code. * **R0:** Revision status.
    ✨ Follow-up Questions
    • ⤷ What is the exact thermal resistance of this heat sink at high airflow speeds (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Does this heat sink require specific PCB hole diameters for the pushPIN system?
    • ⤷ Are there alternative mounting options if my PCB does not have mounting holes?