ATS-19E-65-C2-R0
AI

## Technical Overview: ATS-19E-65-C2-R0
The **ATS-19E-65-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **blueICE™** series, designed for cooling high-power electronic components like CPUs, GPUs, or FPGAs.
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### 1. Key Specifications
The following table outlines the physical and thermal characteristics of this specific part number:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Dimensions** | 45mm x 45mm x 25mm |
| **Thermal Resistance** | 7.29°C/W (at 100 LFM) |
| **Fin Style** | Straight Fin |
| **Compliance** | RoHS Compliant |
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### 2. Component Design Breakdown
#### A. The pushPIN™ Attachment System
One of the defining "electronic parts" of this assembly is the mounting hardware. Unlike adhesive tapes, the **pushPIN™** system uses:
* **Plastic/Brass Pins:** To secure the sink through pre-drilled holes in the PCB.
* **Compression Springs:** These ensure a precise and consistent pressure (Total Force) is applied to the electronic chip, maximizing thermal transfer without cracking the silicon die.
#### B. Thermal Interface Material (TIM)
The "C2" designation typically refers to the **T766 thermal phase-change material** or a high-performance thermal pad pre-applied to the base. This acts as the bridge between the electronic component and the aluminum fins, filling microscopic air gaps.
#### C. Fin Geometry
* **Cross-Cut/Straight Fin:** The "65" in the part number identifies a specific fin configuration. The straight fin design is optimized for **undirected airflow**, allowing air to move through the sink from multiple angles, which is common in dense server or networking enclosures.
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### 3. Application Use Cases
This part is commonly integrated into the following electronic systems:
1. **Telecommunications:** Cooling line cards and signal processors.
2. **Embedded Computing:** High-heat industrial PCs.
3. **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators.
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### 4. Part Number Decoder
Understanding the "Electronic DNA" of the part:
* **ATS:** Advanced Thermal Solutions (Brand).
* **19E:** Series/Family type.
* **65:** Specific fin count/spacing configuration.
* **C2:** Thermal Interface Material (TIM) type and color code.
* **R0:** Revision status.
- ⤷
What is the exact thermal resistance of this heat sink at high airflow speeds (e.g.
- ⤷ 500 LFM)?
- ⤷ Does this heat sink require specific PCB hole diameters for the pushPIN system?
- ⤷ Are there alternative mounting options if my PCB does not have mounting holes?