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  • ATS-19E-85-C2-R0

  • AI
    The **ATS-19E-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling high-density electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Straight | | **Dimension (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 10.00 mm | | **Pitch** | Fine-Pitch | | **Thermal Resistance** | 23.98 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Key Components & Design The "electronic parts" of this assembly include the thermal dissipation hardware and the mechanical mounting system: #### A. Thermal Interface Material (TIM) The base of the heat sink comes pre-applied with **T766**, a high-quality thermal interface material. This fills the microscopic air gaps between the electronic component (die) and the aluminum base to maximize heat transfer. #### B. Push-Pin Mounting System Instead of using adhesive or simple clips, this part uses a precision spring-loaded mechanism: * **Pins:** Brass or Plastic (depending on specific sub-version). * **Springs:** Stainless steel, designed to provide consistent pressure (Force) across the component to ensure optimal thermal contact without cracking the silicon. #### C. Fin Geometry The "Straight" fin design is optimized for environments with a specific airflow direction. The fine pitch increases the surface area for heat to transfer from the metal to the passing air. --- ### 3. Application Use Cases This part is typically integrated into the following electronic systems: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Small form-factor industrial PCs. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Part Number Breakdown (Nomenclature) * **ATS:** Advanced Thermal Solutions (Manufacturer) * **19E:** Series/Family type * **85:** Specific fin and dimension profile * **C2:** Blue Anodized finish * **R0:** Revision/Standard packaging
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve the rated 23.98 °C/W thermal resistance?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ What is the recommended PCB hole pattern for the pushPIN mounting system?