ATS-19E-85-C2-R0
AI

The **ATS-19E-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling high-density electronic components like CPUs, GPUs, and FPGAs.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Fin Type** | Straight |
| **Dimension (L x W)** | 35.00 mm x 35.00 mm |
| **Height** | 10.00 mm |
| **Pitch** | Fine-Pitch |
| **Thermal Resistance** | 23.98 °C/W (Unducted Flow @ 100 LFM) |
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### 2. Key Components & Design
The "electronic parts" of this assembly include the thermal dissipation hardware and the mechanical mounting system:
#### A. Thermal Interface Material (TIM)
The base of the heat sink comes pre-applied with **T766**, a high-quality thermal interface material. This fills the microscopic air gaps between the electronic component (die) and the aluminum base to maximize heat transfer.
#### B. Push-Pin Mounting System
Instead of using adhesive or simple clips, this part uses a precision spring-loaded mechanism:
* **Pins:** Brass or Plastic (depending on specific sub-version).
* **Springs:** Stainless steel, designed to provide consistent pressure (Force) across the component to ensure optimal thermal contact without cracking the silicon.
#### C. Fin Geometry
The "Straight" fin design is optimized for environments with a specific airflow direction. The fine pitch increases the surface area for heat to transfer from the metal to the passing air.
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### 3. Application Use Cases
This part is typically integrated into the following electronic systems:
1. **Telecommunications:** Cooling of high-speed networking chips.
2. **Embedded Systems:** Small form-factor industrial PCs.
3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.
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### 4. Part Number Breakdown (Nomenclature)
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **19E:** Series/Family type
* **85:** Specific fin and dimension profile
* **C2:** Blue Anodized finish
* **R0:** Revision/Standard packaging
- ⤷
What are the airflow requirements to achieve the rated 23.98 °C/W thermal resistance?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ What is the recommended PCB hole pattern for the pushPIN mounting system?