The **ATS-19E-87-C2-R0** is a specific electronic cooling component, categorized as a high-performance **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "maxiFLOW™" product line, designed for cooling high-power semiconductors and integrated circuits. --- ## 1. Technical Specifications The part number encodes specific data about the device's physical and thermal properties. | Parameter | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Base Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Fin Style** | Straight (MaxiFLOW) | | **Dimensions** | 36.83mm x 36.83mm | | **Height** | 20.00mm | | **Thermal Resistance** | ~2.72°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Electronic Features ### A. maxiFLOW™ Design The "87" in the part number refers to the specific fin geometry. The **maxiFLOW™** design features a spread fin structure which reduces pressure drop and maximizes the surface area for radiant and convective cooling. This is critical for electronic components that generate high heat in small footprints. ### B. pushPIN™ Attachment Unlike adhesive tapes that can fail under high heat, this model uses a **pushPIN™** system. * **Mechanical Reliability:** Uses a brass or plastic pin with a compressed spring. * **Firm Contact:** Ensures consistent pressure between the heat sink and the electronic chip, which is vital for efficient heat transfer. * **Installation:** Requires pre-drilled holes on the Printed Circuit Board (PCB). ### C. Thermal Interface Material (TIM) The **C2** designation indicates the type of thermal interface material pre-applied to the base. * It uses **T766**, a high-performance phase-change material or grease that fills microscopic air gaps between the chip and the aluminum base to improve thermal conductivity. --- ## 3. Typical Applications This part is commonly used to cool the following electronic components: 1. **CPUs and Microprocessors:** Found in embedded systems. 2. **FPGAs (Field Programmable Gate Arrays):** Which generate significant localized heat. 3. **ASICs:** Application-specific chips used in networking and telecommunications. 4. **Power Transistors:** Used in high-density power supply units. --- ## 4. Ordering/Model Breakdown ```text ATS - 19 E - 87 - C2 - R0 | | | | | | | | | +--> Revision code | | | +-------> Thermal Interface Material (T766) | | +------------> Fin Pattern (maxiFLOW) | +------------------> Attachment Type (pushPIN) +------------------------> Advanced Thermal Solutions ```