The **ATS-19E-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Part Number** | ATS-19E-99-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 20mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 11.51°C/W (at 100 LFM) to 1.72°C/W (at 700 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Features and Technologies #### **A. pushPIN™ Attachment System** Unlike basic adhesive heat sinks, this part uses a **pushPIN™** system. This provides several advantages: * **Constant Pressure:** Ensures the heat sink maintains firm contact with the component for optimal heat transfer. * **Durability:** The brass or plastic pins and stainless steel springs are more reliable under mechanical stress or vibration than tape. * **Easy Installation:** Features a pre-drilled hole pattern for quick assembly. #### **B. Fin Design (Cross-Cut)** The fins are designed in a **cross-cut** or "straight fin" configuration. This is optimized for: * **Airflow:** It allows for multidirectional air intake, which is critical in cramped server or PC environments where air may not flow in a perfectly straight line. * **Surface Area:** Maximize the cooling surface area relative to its footprint (45mm x 45mm). #### **C. Thermal Interface Material (TIM)** The "C2" in the part number indicates it comes with **T766 phase-change material**. * This material fills the microscopic air gaps between the component and the heat sink base. * It is pre-applied to the bottom, reducing assembly time and ensuring a consistent layer thickness. --- ### 3. Application Examples This part is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial Computing:** Embedded systems that require passive or forced-air cooling. 3. **Power Supplies:** Cooling voltage regulators and MOSFETs.