The part number **ATS-19G-129-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Heat Sink Type** | Push-pin (Straight Fin) | | **Thermal Resistance** | 8.68°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Attachment Method** | Brass Push-Pin (Spring-loaded) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Design and Construction * **Low Profile:** With a height of only 10mm, this component is designed for systems with limited vertical space, such as 1U servers or compact embedded devices. * **Fin Style:** It utilizes a **Straight Fin** pattern. This design is optimized for environments where there is a consistent, directed airflow (ducted or fan-driven). * **Blue Anodized Coating:** The aluminum is treated with a blue anodized finish, which provides corrosion resistance and increases thermal emissivity. --- ### 3. Mounting System (The "Push-Pin") The **-C2-R0** suffix indicates a specific mounting configuration: 1. **Push-Pin Mechanism:** It uses brass pins with a built-in spring. This ensures a constant, even pressure across the surface of the electronic chip, which is critical for efficient heat transfer. 2. **Pre-applied TIM:** The "T766" thermal interface material is a phase-change material applied to the bottom. This eliminates the need for manual application of thermal paste during assembly. --- ### 4. Thermal Performance Comparison The effectiveness of this heatsink depends heavily on the Airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 8.68 | | 300 (Moderate) | 3.11 | | 500 (High) | 2.25 | --- ### 5. Common Applications * **Networking Gear:** Switches and routers where internal airflow is managed. * **Industrial PCs:** Cooling chips on motherboards that operate in harsh environments. * **LED Cooling:** High-output LED arrays that require consistent heat dissipation to prevent color shift or burnout.