The **ATS-19G-22-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. --- ## 1. Component Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-19G-22-C2-R0 | | **Product Type** | Heat Sink (Blue Anodized) | | **Fin Type** | Push-Pin / Cross-Cut | | **Material** | Aluminum | | **Thermal Resistance** | 13.83 °C/W (at 1.0 m/s airflow) | | **Attachment Method** | Push-Pin (2-Point) | | **Interface Material** | T766 (Thermal Tape/Grease) | --- ## 2. Technical Breakdown ### A. Material and Coating The unit is constructed from **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. The "C2" suffix typically denotes a **Blue Anodized** finish. This coating serves two purposes: 1. **Corrosion Resistance:** Protects the aluminum from oxidation. 2. **Radiation:** Increases the surface emissivity, slightly improving heat dissipation through radiation. ### B. Fin Geometry This model utilizes a **Cross-Cut** or "Pin Fin" design. Unlike straight-fin heat sinks, the cross-cut pattern allows for: * **Omnidirectional Airflow:** Heat can be dissipated regardless of the direction the cooling fan is blowing. * **Turbulence:** It breaks up laminar airflow, creating turbulence that pulls more heat away from the fin surfaces. ### C. Attachment System (Push-Pin) The "R0" at the end of the part number refers to the specific revision and mounting kit. The push-pin mechanism uses a spring-loaded plastic pin that snaps into pre-drilled holes on a PCB (Printed Circuit Board). This provides: * **Consistent Pressure:** The springs ensure the heat sink maintains even contact with the chip. * **Vibration Resistance:** Securely holds the component in place during transport or mechanical stress. --- ## 3. Dimensions Understanding the footprint is critical for PCB layout design: | Dimension | Measurement | | :--- | :--- | | **Length** | 40.00 mm | | **Width** | 40.00 mm | | **Height** | 12.70 mm | --- ## 4. Performance Data The cooling efficiency depends on the velocity of the air moving across the fins: * **@ 1.0 m/s (200 LFM):** 13.83 °C/W * **@ 2.0 m/s (400 LFM):** 8.20 °C/W * **@ 3.0 m/s (600 LFM):** 6.60 °C/W ---