The **ATS-19G-47-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push Pin (Plastic) | | **Base Dimensions** | 25mm x 25mm | | **Height** | 20mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 9.30°C/W (at 100 LFM) | | **Finish** | Blue Anodized | --- ### Key Design Components #### 1. Push-Pin Attachment Mechanism The "G" in the part number often signifies the attachment type. This model uses a **spring-loaded push-pin** system. This provides several advantages: * **Constant Pressure:** Ensures a firm, even contact between the heat sink and the component, optimizing thermal transfer. * **Easy Installation:** No tools are required; the pins snap into pre-drilled holes in the PCB. #### 2. Fin Configuration The heat sink features a **Straight Fin** design. * This is ideal for **forced air cooling** environments (where a fan is present). * The vertical fins provide a large surface area relative to the small 25x25mm footprint, allowing air to flow through and carry heat away efficiently. #### 3. Material and Coating * **AL6063 Aluminum:** This alloy is chosen for its excellent thermal conductivity and structural integrity. * **Blue Anodized Finish:** Anodization protects the aluminum from corrosion and slightly improves radiant heat emission. --- ### Thermal Performance Data (Airflow) Performance varies based on the Velocity of air (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 9.30 | | 300 (1.5 m/s) | 5.21 | | 500 (2.5 m/s) | 4.32 | | 700 (3.5 m/s) | 3.82 | --- ### Application Usage This specific part is typically used on **small form-factor PCBs** where vertical space is available (20mm height) but horizontal space is limited (25mm width). Common applications include: * Embedded systems and IoT gateways. * Network switches and routers. * Power supply modules (VRMs).