ATS-19G-48-C2-R0
AI

The **ATS-19G-48-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-19G-48-C2-R0 |
| **Material** | Aluminum (Lightweight and high conductivity) |
| **Finish** | Blue Anodized (Protects against corrosion) |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied thermal grease) |
| **Dimensions (L x W x H)** | 25mm x 25mm x 15mm |
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### 2. Physical Design & Fins
This heat sink utilizes a **Fine Pitch** design to maximize surface area within a small footprint.
* **Fin Type:** Straight Fin.
* **Pitch:** High density for optimal airflow engagement.
* **Performance:** Designed to work effectively in both natural convection and forced air (fan-cooled) environments.
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### 3. Mounting Mechanism (pushPIN™)
The "pushPIN™" system is a specific electronic mounting standard developed by ATS to ensure reliable contact between the heat sink and the electronic component.
* **Springs:** High-tension springs ensure consistent pressure across the surface.
* **Hardware:** Flexible mounting options including brass or plastic pins.
* **Compression:** Prevents the heat sink from shifting during mechanical shock or vibration.
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### 4. Thermal Resistance Properties
Thermal resistance (measured in °C/W) indicates how effectively the part moves heat away from the component.
| Airflow Velocity | Thermal Resistance (Unducted) |
| :--- | :--- |
| **@100 LFM (0.5 m/s)** | 7.50 °C/W |
| **@300 LFM (1.5 m/s)** | 3.90 °C/W |
| **@500 LFM (2.5 m/s)** | 3.10 °C/W |
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### 5. Part Number Nomenclature
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **19:** Series designation.
* **G:** Material/Fin geometry code.
* **48:** Specific footprint/size identifier.
* **C2:** Material finish and thermal grease type (Blue Anodized + T766).
* **R0:** Revision code.
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What is the difference between T766 and other thermal interface materials used in this series?
- ⤷ Can this heat sink be used for power transistors in TO-220 packages?
- ⤷ How do I calculate the required LFM (Linear Feet per Minute) for my specific chip wattage?