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  • ATS-19G-48-C2-R0

  • AI
    The **ATS-19G-48-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-19G-48-C2-R0 | | **Material** | Aluminum (Lightweight and high conductivity) | | **Finish** | Blue Anodized (Protects against corrosion) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied thermal grease) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | --- ### 2. Physical Design & Fins This heat sink utilizes a **Fine Pitch** design to maximize surface area within a small footprint. * **Fin Type:** Straight Fin. * **Pitch:** High density for optimal airflow engagement. * **Performance:** Designed to work effectively in both natural convection and forced air (fan-cooled) environments. --- ### 3. Mounting Mechanism (pushPIN™) The "pushPIN™" system is a specific electronic mounting standard developed by ATS to ensure reliable contact between the heat sink and the electronic component. * **Springs:** High-tension springs ensure consistent pressure across the surface. * **Hardware:** Flexible mounting options including brass or plastic pins. * **Compression:** Prevents the heat sink from shifting during mechanical shock or vibration. --- ### 4. Thermal Resistance Properties Thermal resistance (measured in °C/W) indicates how effectively the part moves heat away from the component. | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **@100 LFM (0.5 m/s)** | 7.50 °C/W | | **@300 LFM (1.5 m/s)** | 3.90 °C/W | | **@500 LFM (2.5 m/s)** | 3.10 °C/W | --- ### 5. Part Number Nomenclature * **ATS:** Manufacturer (Advanced Thermal Solutions). * **19:** Series designation. * **G:** Material/Fin geometry code. * **48:** Specific footprint/size identifier. * **C2:** Material finish and thermal grease type (Blue Anodized + T766). * **R0:** Revision code.
    ✨ Follow-up Questions
    • ⤷ What is the difference between T766 and other thermal interface materials used in this series?
    • ⤷ Can this heat sink be used for power transistors in TO-220 packages?
    • ⤷ How do I calculate the required LFM (Linear Feet per Minute) for my specific chip wattage?