The **ATS-19G-98-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions** | 45.00mm x 45.00mm | | **Height** | 15.00mm | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Thermal Resistance** | 1.53°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Fin Design (maxiFLOW™) The "98" in the part number corresponds to a specific fin pattern. The maxiFLOW™ design features a **flared fin structure**. Unlike straight-fin heat sinks, these flared fins increase the surface area and improve airflow ingestion, making them more efficient in environments with limited space or high-velocity air. #### B. Attachment Mechanism (pushPIN™) The **-R0** suffix indicates the assembly includes the **pushPIN™** attachment system. This consists of: * **Brass Pins:** Provide secure mechanical attachment to the PCB. * **Compression Springs:** Ensure consistent pressure between the heat sink and the electronic component for optimal heat transfer. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a high-performance phase-change material that fills microscopic air gaps between the chip and the heat sink, significantly lowering contact resistance. --- ### 3. Part Number Breakdown The nomenclature follows a specific logic: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **19G** | maxiFLOW™ product line | | **98** | Specific Fin Geometry/Size | | **C2** | Thermal Performance Grade / Material | | **R0** | Packaging and Attachment Revision (Push-pin) | --- ### 4. Application Use Case This part is typically used in: * **Telecommunications:** High-speed routers and switches. * **Computing:** Embedded systems and industrial motherboards. * **Power Electronics:** Dissipating heat from high-wattage voltage regulators.