The **ATS-19H-34-C2-R0** is a specific high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed primarily for cooling electronic components like CPUs, GPUs, and ASICs. --- ## 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | maxiFLOW™ High Performance | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 57.60mm x 40.00mm x 22.90mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 6.73°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Electronic Components & Features ### A. Fin Geometry (maxiFLOW™) The "H" in the part number indicates a **High Performance** fin profile. The fins are tapered and spread out to maximize surface area while minimizing pressure drop. This is critical for electronic circuits where space is tight but heat dissipation needs are high. ### B. pushPIN™ Attachment System Rather than using messy adhesives, this part uses the **pushPIN™** mechanism. * **Hardware:** Includes a brass or plastic pin and a high-performance compression spring. * **PCB Integration:** Requires pre-drilled holes in the Printed Circuit Board (PCB). * **Benefit:** Ensures consistent pressure across the electronic chip (IC), which optimizes heat transfer and prevents the component from cracking due to uneven stress. ### C. Thermal Interface Material (TIM) The **C2** designation indicates that the heatsink comes with **T766** thermal phase-change material pre-applied. * **Function:** Fills microscopic air gaps between the electronic component's top surface and the aluminum base. * **Performance:** T766 provides high thermal conductivity and is designed for long-term reliability in high-heat electronic environments. --- ## 3. Application Use Cases This specific part is typically found in the following electronic systems: 1. **Networking Hardware:** Switches and routers where airflow is directional. 2. **Industrial PCs:** Compact enclosures requiring efficient passive or active cooling. 3. **Power Supplies:** Cooling MOSFETs or power regulators. --- ## 4. Performance at Variable Airflow The thermal efficiency changes based on the Linear Feet per Minute (LFM) of the airflow: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 6.73 | | 400 | 3.57 | | 600 | 2.50 |