The **ATS-19H-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### Technical Specifications This part is designed for high-density electronic cooling where airflow and space efficiency are critical. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-19H-71-C2-R0 | | **Heat Sink Type** | Push-Pin (Aluminum) | | **Thermal Resistance** | 1.95°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Fin Style** | Straight Fin | | **Material / Finish** | Aluminum / Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Components & Features #### 1. Push-Pin Attachment Mechanism Instead of adhesive tapes, this model uses a **push-pin and spring** system. - **Benefit:** Provides consistent pressure for optimal heat transfer. - **Reliability:** Prevents the heat sink from shifting or detaching during mechanical shock or vibration. #### 2. Material and Finish The heat sink is made from extruded **Aluminum**. - **Blue Anodization:** This is not just for aesthetics; the anodized coating increases the surface emissivity, slightly improving radiation cooling and protecting the aluminum from corrosion. #### 3. High-Performance Fin Design The straight-fin design is optimized for **forced air cooling**. - As airflow (LFM - Linear Feet per Minute) increases, the thermal resistance drops significantly (down to approximately 0.77°C/W at 800 LFM). #### 4. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. - This is a high-performance phase-change material that fills microscopic air gaps between the electronic component (CPU/GPU/FPGA) and the heat sink base to ensure maximum thermal conductivity. --- ### Typical Applications This specific part is used for cooling high-heat-generating electronic components, including: * **ASICs and FPGAs** in networking equipment. * **Power Supplies** and VRMs. * **Embedded Systems** with high-speed processing requirements.