The **ATS-20A-63-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It is designed for cooling high-power semiconductors and integrated circuits. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below are the primary specifications: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Heat Sink Type** | Push-Pin (maxiFLOW™ design) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | ~1.30°C/W (at 200 LFM) | | **Dimensions** | 45mm x 45mm x 20mm | --- ### 2. Key Electronic Features The "C2" and "R0" designations provide specific details about the materials and compliance: * **maxiFLOW™ Geometry:** The fin pattern is designed to maximize surface area and increase turbulence in the airflow, which significantly lowers the thermal resistance compared to standard extruded heat sinks. * **Push-Pin Attachment:** This uses a spring-loaded mechanism that provides a consistent pressure on the electronic component (CPU, GPU, or FPGA). This ensures optimal contact with the **Thermal Interface Material (TIM)**. * **C2 (Material Code):** Indicates the use of a specific high-performance thermal pad or interface material pre-applied to the base of the heat sink. * **R0 (RoHS Compliance):** Confirms that the part is lead-free and compliant with environmental safety standards. --- ### 3. Thermal Performance Comparison Understanding how this part handles heat is crucial for circuit protection. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 1.30 | | 400 (2.0 m/s) | 0.85 | | 600 (3.0 m/s) | 0.68 | --- ### 4. Typical Applications This part is commonly used in electronic systems where space is limited but heat dissipation requirements are high: 1. **Telecommunications:** Cooling network switches and routers. 2. **Data Centers:** Server blade cooling. 3. **Industrial:** High-speed motor controllers and power supplies. 4. **Computing:** High-performance FPGAs and ASICs.