The **ATS-20A-76-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heatsink**. It is part of the "maxiFLOW" product line, designed to provide efficient cooling for electronic components like BGAs (Ball Grid Arrays). --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below are the primary specifications for this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 11.57° C/W (at 200 LFM) | | **Length/Width** | 25.00 mm x 25.00 mm | | **Height** | 25.00 mm | | **Weight** | ~40 grams | --- ### 2. Design and Engineering Features The "C2" suffix indicates specific material and thermal properties intended for high-reliability environments: * **maxiFLOW™ Fin Geometry:** The fins are designed with a tapered shape to increase the surface area while reducing pressure drop. This allows for better airflow through the fins, significantly improving thermal performance compared to standard square-fin heatsinks. * **pushPIN™ Attachment:** Instead of messy adhesives or fragile clips, this part uses a mechanical push-pin system. These pins are spring-loaded to ensure constant, even pressure on the chip, which optimizes the thermal interface material (TIM) performance. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766**, a high-performance thermal grease, ensuring immediate "out-of-the-box" installation. --- ### 3. Application Use Cases The ATS-20A-76-C2-R0 is commonly used in high-density electronic assemblies where space is limited but heat dissipation is critical. 1. **Telecommunications:** Cooling of high-speed networking chips and routers. 2. **Embedded Computing:** Protecting CPUs or FPGAs on small form factor boards (SBCs). 3. **Power Supplies:** Managing heat for power converters and voltage regulators. --- ### 4. Thermal Performance Data (Airflow) | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 11.57 | | 400 (2.0 m/s) | 6.84 | | 600 (3.0 m/s) | 5.28 | | 800 (4.0 m/s) | 4.47 |