The **ATS-20B-170-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heatsink** designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows the standard nomenclature used by **Advanced Thermal Solutions (ATS)**. Here is the breakdown of its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (High Thermal Conductivity) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Brass Springs | | **Dimensions** | 25.0mm x 25.0mm (Length x Width) | | **Height** | 15.0mm | | **Fin Type** | XC-Cut (Cross-Cut) | | **Thermal Resistance** | 10.07 °C/W (at 1.0 m/s airflow) | | **Thermal Interface (TIM)** | T766 (High Performance Phase-Change) | --- ### 2. Key Electronic Components & Features #### A. The XC-Cut Fin Design The "XC-Cut" refers to the straight-fin design with cross-cuts. In electronics, this is critical because it allows for **multi-directional airflow**. If the airflow in your PCB housing changes direction, this heatsink maintains efficiency better than standard straight-fin models. #### B. Attachment: Push-Pin & Spring Unlike adhesive-based heatsinks, the `20B` series uses a mechanical attachment: * **Push-Pins:** These provide a secure, vibration-resistant mount to the PCB. * **Springs:** These ensure constant **clamping force**, which is vital for maintaining a consistent "bond line" (the thickness of the thermal paste), preventing air gaps that cause overheating. #### C. Thermal Interface Material (T766) The part comes pre-applied with **ATS T766**. This is a phase-change material that softens at high temperatures, filling microscopic surface irregularities between the electronic chip and the heatsink base. --- ### 3. Application Use Cases This specific part is typically used for small-form-factor electronics where space is limited but heat density is high: 1. **Network Switches:** Cooling high-speed ASICs. 2. **Embedded Systems:** Protecting microprocessors in industrial environments. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators. ---