The **ATS-20B-209-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to the "push-pin" attachment family of thermal management solutions. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Base Part Number** | ATS-20B-209-C2-R0 | | **Type** | Board Level, Square Fin Heat Sink | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions** | 70mm x 70mm | | **Height (Off Base)** | 6.00mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.27°C/W @ 100 LFM | --- ### 2. Design and Construction This component is engineered to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or high-power transistors. * **Fin Profile:** It features a "super-fine" pitch pattern to maximize surface area for heat exchange within a low-profile (6mm) footprint. * **Thermal Interface Material (TIM):** The "C2" in the part number indicates it comes pre-applied with **T766 Phase Change Material**, which ensures high-efficiency heat transfer between the chip and the aluminum base. * **Mounting System:** It utilizes a **Brass Push-Pin** with a stainless steel spring. This provides a constant, calibrated pressure on the electronic component to prevent gaps and optimize cooling performance. --- ### 3. Usage Context Because of its ultra-low height (6.00mm), this part is typically used in space-constrained electronic environments: 1. **Network Switches/Routers:** Where high-speed chips generate heat in narrow rack-mount enclosures. 2. **Blade Servers:** Where vertical clearance is strictly limited. 3. **Industrial Controls:** For cooling power modules on PCBs that are stacked closely together. --- ### 4. Thermal Performance Data Thermal resistance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 6.27 | | 300 (Unducted) | 3.01 | | 500 (Unducted) | 2.18 |