The **ATS-20B-28-C2-R0** is a specific electronic component categorized as a **Heat Sink**, designed and manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" and "maxiFLOW" product lines, intended for cooling high-performance semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Fin Field (maxiFLOW) | | **Attachment Method** | superGRIP (Clip-on) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimension (L x W)** | 45mm x 45mm | | **Height** | 17.5mm | | **Thermal Resistance** | 3.50°C/W @ 200 LFM | --- ### 2. Electronic/Mechanical Components The "part" is an assembly consisting of several electronic-adjacent mechanical components: * **The Heat Sink Body:** Features a high-aspect-ratio fin design (maxiFLOW) which increases surface area and creates turbulence in the airflow, significantly improving thermal performance compared to standard square-cut sinks. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **Chomerics T766**, a phase-change material that ensures a low-resistance thermal path between the chip and the aluminum. * **superGRIP™ Attachment:** The "20B" designation refers to the attachment mechanism. It uses a plastic frame (clip) that snaps onto the PCB, meaning no holes are required in the motherboard. This prevents the heat sink from shifting during vibration or shock. --- ### 3. Part Number Breakdown The code **ATS-20B-28-C2-R0** can be decoded as follows: * **ATS:** Manufacturer prefix. * **20B:** Refers to the superGRIP™ attachment style (specifically for BGA components). * **28:** A code representing the specific fin height and density configuration. * **C2:** Refers to the color/finish (Blue Anodized) and thermal performance grade. * **R0:** Revision code or RoHS compliance indicator. --- ### 4. Applications This part is primarily used to cool specific integrated circuits (ICs) that generate significant heat: 1. **BGA Packages:** Ball Grid Array processors or FPGAs. 2. **Networking Hardware:** High-speed routers and switches. 3. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.