The **ATS-20D-134-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 70mm x 70mm | | **Height** | 25mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 0.44°C/W (at high airflow) | --- ### 2. Design Breakdown The part number follows a specific nomenclature used by ATS to describe its features: #### **Fin Pattern: Cross-Cut** * This heat sink features a **fine-pitch fin pattern** which maximizes surface area. * The "Cross-Cut" design allows for multi-directional airflow, making it versatile for systems where the air might not flow in a single straight path. #### **Attachment: pushPIN™ System** * Instead of using thermal adhesive (which can fail over time), this part uses a mechanical **push-pin and spring** mechanism. * **Springs:** Usually made of high-carbon steel or stainless steel to ensure consistent pressure (Force) against the electronic chip, optimizing heat transfer. #### **Thermal Interface Material (TIM)** * The **"R0"** suffix typically indicates that the part comes pre-applied with a thermal interface material (like a phase-change pad or thermal grease) or features a specific mounting hole pattern. --- ### 3. Application Use Cases This specific model is used in industrial and high-performance computing environments: 1. **Network Switches/Routers:** To cool high-speed processing ASICs. 2. **Embedded Systems:** Where the board is subjected to vibration and requires a mechanical attachment (push-pins). 3. **Power Electronics:** Cooling MOSFETs or IGBT modules in power supplies. --- ### 4. Installation Reference When integrating this into a PCB design, the following considerations apply: ```markdown 1. Hole Diameter: Requires specific PCB drill holes for the push-pins (usually 3.0mm or 3.175mm). 2. Keep-out Zone: Ensure a 70x70mm clearance around the component. 3. Airflow Direction: Optimized for forced convection (fan-cooled environments). ```