## Electronic Specifications: ATS-20D-28-C2-R0 The **ATS-20D-28-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is a mechanical component, its design is dictated by electronic thermal management requirements. ### 1. Product Overview This specific part belongs to the **maxiFLOW™** series, designed for high-power electronic components (like CPUs, FPGAs, or GPUs) that require efficient heat dissipation in a constrained airflow environment. --- ### 2. Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-20D-28-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing Air)** | 10.62 °C/W @ 100 LFM | | **Thermal Resistance (Static Air)** | ~ 2.00 °C/W (at peak performance) | | **Dimensions (L x W x H)** | 45mm x 45mm x 17.78mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 3. Key Electronic-Related Features #### A. Thermal Interface Material (TIM) The "C2" in the part number indicates the use of **T766 thermal phase change material**. * **Function:** It fills microscopic air gaps between the electronic chip surface and the heat sink base. * **Advantage:** Minimizes contact resistance, ensuring maximum heat transfer from the silicon die to the aluminum fins. #### B. pushPIN™ Attachment System Electronic PCBs (Printed Circuit Boards) are fragile. This part uses a specialized attachment system: * **Spring-loaded mechanism:** Provides precise, uniform pressure across the component. * **Prevention of Damage:** Ensures the heat sink does not crack the chip's die or warp the PCB during installation or thermal expansion. #### C. maxiFLOW™ Fin Design The fin geometry is optimized for "electronic cooling" rather than general industrial cooling. * **High Aspect Ratio:** The fins are thin and spread out to increase surface area without significantly increasing the weight on the electronic board. * **Airflow Efficiency:** It is designed to work with standard system fans found in servers and high-end workstations. --- ### 4. Thermal Performance Data Performance varies based on the airflow (LFM - Linear Feet per Minute) generated by the system's cooling fans: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 10.62 | | 200 | 3.52 | | 300 | 2.02 | | 400 | 1.61 | | 500 | 1.39 | ---