The **ATS-20G-142-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heatsink** designed for cooling integrated circuits (ICs) and electronic modules. Below is a breakdown of its technical specifications and electronic application characteristics. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Fin Style** | High-Performance XC-Cut | | **Thermal Resistance** | 4.72°C/W @ 100 LFM (Linear Feet per Minute) | | **Dimensions (L x W x H)** | 30mm x 30mm x 15mm | | **Pressure Spring** | 21-gram compression force | --- ### 2. Key Electronic Components & Design #### A. XC-Cut Fin Geometry Unlike standard straight-fin heatsinks, the "XC-Cut" design uses a cross-cut pattern. This allows for: * **Multi-directional Airflow:** Efficient cooling regardless of which direction the fan is blowing. * **Turbulence Induction:** It breaks up the boundary layer of air, increasing heat transfer from the aluminum to the environment. #### B. Attachment Mechanism (Push-Pin) This part utilizes a spring-loaded push-pin system. From an electronic assembly perspective: * **Mechanical Stability:** It ensures constant pressure on the semiconductor (CPU/FPGA), which optimizes the thermal interface material (TIM) performance. * **Hole Pattern:** It requires specific pre-drilled holes on the PCB (Printed Circuit Board) to lock the pins in place. #### C. Material Properties * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This isn't just for aesthetics; the anodized finish increases surface emissivity, slightly improving radiative cooling, and provides electrical insulation and corrosion resistance. --- ### 3. Application Use Cases This specific part is typically found in the following electronic systems: 1. **Telecommunications:** Cooling for high-speed network switches and routers. 2. **Embedded Systems:** Heat dissipation for ARM-based processors or FPGAs. 3. **Power Electronics:** Managing heat for MOSFET arrays or voltage regulators in compact enclosures. --- ### 4. Thermal Performance Data The cooling efficiency varies based on the airflow provided by the system's fans: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 4.72 | | 200 | 1.0 | 2.95 | | 400 | 2.0 | 2.11 |