The **ATS-20G-33-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, known for its high-aspect-ratio fin design which provides maximum surface area for cooling. --- ## 1. Technical Specifications Below is a breakdown of the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Product Category** | Heat Sink | | **Series** | maxiFLOW™ | | **Base Dimensions** | 36.9mm x 36.9mm | | **Height** | 14.5mm | | **Thermal Resistance** | 3.29 °C/W (at 200 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Pre-assembled) | --- ## 2. Key Electronic & Mechanical Features ### A. maxiFLOW™ Fin Geometry The "G" in the part number signifies the **maxiFLOW™** design. Unlike standard rectangular fin heat sinks, this design features spread fins that reduce pressure drop and increase airflow through the fin field. This is critical for densely packed electronic PCBs where airflow might be obstructed. ### B. Thermal Interface Material (TIM) * **Part Suffix (-R0):** Indicates that the heat sink comes with a **Phase Change Material (PCM)** or a high-performance thermal pad already applied to the base. * **Efficiency:** This eliminates the need for manual thermal paste application and ensures a low thermal resistance path between the electronic component (CPU, GPU, or ASIC) and the heat sink. ### C. Attachment System: pushPIN™ The assembly includes a specialized attachment mechanism: * **Hardware:** Brass or plastic pins with a stainless steel spring. * **Reliability:** The springs provide a precise, consistent pressure (preload) on the electronic component, which prevents damage from over-tightening while ensuring optimal thermal contact. --- ## 3. Applications This specific part size and thermal profile are commonly used for cooling the following electronic components: 1. **BGA Packages:** High-speed processors or FPGAs. 2. **Power Electronics:** Voltage regulators and converters. 3. **Telecommunications:** Networking chips that operate in high-ambient temperature environments. ---