The **ATS-20G-35-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) with Brass Springs | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 12.42°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 15mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Design & Construction * **Material and Finish:** The heat sink is made of extruded aluminum for optimal heat conductivity. The **Blue Anodized** finish is not just for aesthetics; it provides corrosion resistance and slightly improves radiative heat transfer. * **Fin Geometry:** It utilizes a high-performance straight-fin design. This is ideal for systems with directed airflow (forced convection), as it allows air to pass through the channels with minimal pressure drop. * **Attachment Mechanism:** The "Push-Pin" system utilizes plastic pins and compression springs. This ensures a secure, uniform pressure across the electronic component, which is critical for minimizing the thermal contact resistance. --- ### 3. Electronic Application This part is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of networking chips in routers and switches. 2. **Embedded Systems:** Heat dissipation for processors on Single Board Computers (SBCs). 3. **Power Electronics:** Managing heat for high-power transistors or voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 12.42 | | 300 | 7.42 | | 400 | 5.34 | | 500 | 4.32 | --- ### 5. Installation Note The **C2** in the part number indicates a specific spring/pin configuration. When designing a PCB for this part, the hole pattern must match the 35x35mm footprint precisely to ensure the push-pins engage correctly and provide the rated pressure.