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  • ATS-20H-29-C2-R0

  • AI
    The **ATS-20H-29-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ## 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Heat Sink Type** | Push-Pin (Standard) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Thermal Resistance** | 7.57° C/W (@ 100 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Interface Material** | T766 (Thermal Interface Material) | --- ## 2. Key Features and Components ### A. Material and Design * **Aluminum Construction:** The use of aluminum provides a high level of thermal conductivity while keeping the weight low. * **Blue Anodized Coating:** The blue anodization is not just aesthetic; it increases the surface emissivity and protects the aluminum from corrosion and electrical shorting. * **Cross-Cut Fin Pattern:** The "H" in the part number often refers to a specific high-efficiency fin geometry that allows for multi-directional airflow. ### B. Attachment Mechanism (Push-Pin) This model utilizes a **Push-Pin** assembly. * It consists of a plastic pin and a spring. * The pins snap into pre-drilled holes on the Printed Circuit Board (PCB). * The spring provides consistent pressure, ensuring optimal contact between the heat sink and the electronic component. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. This is a thermal pad or paste that fills microscopic air gaps between the heat sink and the component, significantly reducing thermal resistance. --- ## 3. Part Number Breakdown The part number follows the standard ATS nomenclature: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **20:** Height of the heat sink (20mm). * **H:** High-performance fin geometry. * **29:** Series or specific design iteration. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or RoHS compliance status. ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole size requirements for the push-pin attachment?
    • ⤷ How does the thermal resistance change at higher airflow rates (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Is there a version of this heat sink that uses thermal tape instead of push-pins?