The **ATS-20H-48-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed to optimize airflow and heat dissipation for electronic components like BGAs (Ball Grid Arrays). --- ### 1. Technical Specifications The following table breaks down the electronic and physical characteristics of this part: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink (Push-Pin Mount) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 47.50mm x 47.50mm | | **Height** | 19.00mm | | **Attachment Method** | Push-Pin (2-point) | | **Thermal Resistance** | 2.82°C/W (at 200 LFM) | | **Attachment Spring** | Brass / Plastic (R0 indicates Plastic) | | **Interface Material** | T766 (Pre-applied Thermal Pad) | --- ### 2. Design and Component Functionality #### MaxiFLOW™ Geometry The "H" in the part number refers to the specific fin pattern. The maxiFLOW™ design features a **flared fin structure** which maximizes the surface area for convective heat transfer while minimizing pressure drop. This is critical for densely packed PCBs where airflow may be obstructed. #### The Attachment System (Push-Pin) Instead of using messy adhesives or thermal tape, this part uses a mechanical **Push-Pin and Compression Spring** system. * **Mechanical Integrity:** Provides consistent pressure (clamping force) across the component. * **Thermal Interface:** Comes with **T766** pre-applied. This is a Phase Change Material (PCM) or high-performance pad that fills microscopic air gaps between the heat sink and the electronic chip (CPU, FPGA, or ASIC). #### Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer increases thermal emissivity and protects the aluminum from corrosion. --- ### 3. Application Use Cases This part is typically found in high-reliability electronic environments: * **Telecommunications:** Cooling high-speed switching silicon. * **Embedded Systems:** Industrial PCs and controllers. * **Network Hardware:** Routers and Server motherboards. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **20** | Series/Mounting Hole Spacing | | **H** | Fin Geometry Type | | **48** | Size (approx. 47.5mm - 48mm) | | **C2** | Thermal Performance Grade / Material Type | | **R0** | RoHS Compliant / Plastic Push-Pin version |