The **ATS-20H-75-C1-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Thermal Resistance** | 7.17 °C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | Straight Fin | --- ### 2. Electronic Application & Function While not a semiconductor itself, this part is vital for the thermal management of electronic systems. * **Heat Dissipation:** It is designed to be mounted directly onto Integrated Circuits (ICs), such as CPUs, GPUs, FPGAs, or power transistors, to conduct heat away from the die. * **pushPIN™ Technology:** This specific model uses a spring-loaded push-pin mechanism. This ensures a consistent pressure (compression) on the thermal interface material (TIM), which improves heat transfer efficiency compared to simple adhesive tapes. * **Low Profile:** With a height of only 10mm, it is ideal for dense electronic enclosures or 1U server racks where vertical clearance is limited. --- ### 3. Key Components of the Assembly 1. **The Heat Sink Body:** Extruded aluminum with a high surface-area-to-volume ratio to maximize convection. 2. **Push-Pins:** Usually made of flexible nylon or durable brass to secure the sink to the PCB through pre-drilled holes. 3. **Springs:** Provides the required downward force to maintain contact during vibration or thermal expansion. 4. **Thermal Interface (Optional/Pre-applied):** Often comes with a pre-applied high-performance thermal phase-change material or pad. ---