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  • ATS-20H-80-C2-R0

  • AI
    The **ATS-20H-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like BGA (Ball Grid Array) chips, CPUs, or GPUs. --- ## 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-20H-80-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (2-Pin) | | **Footprint (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Thermal Resistance** | ~3.67°C/W (at 200 LFM) | | **Spring Type** | Stainless Steel (R0 suffix) | --- ## 2. Key Electronic Features ### A. Pin Fin Design Unlike traditional straight-fin heat sinks, the "H" series uses a **cross-cut pin fin** geometry. * **Omnidirectional Airflow:** It is ideal for systems where the direction of airflow is inconsistent or unknown. * **Increased Surface Area:** The pin structure increases the total surface area for heat exchange without significantly increasing the footprint. ### B. Push-Pin Attachment The **C2** designation refers to the attachment mechanism. * It uses a plastic push-pin with a built-in spring. * The spring provides **precise pressure** (Load) on the electronic component, ensuring maximum thermal contact without damaging the delicate silicon die. ### C. Thermal Interface Material (TIM) Most "R0" variants come pre-applied with a high-performance thermal interface material (like ATS-54) on the base. This fills microscopic air gaps between the heat sink and the chip to improve heat transfer. --- ## 3. Application Use Cases This part is typically found in the following electronic environments: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Computing:** Industrial PC boards and motherboards. 3. **Power Electronics:** Voltage regulators or power modules that generate significant localized heat. --- ## 4. Part Number Breakdown Understanding the nomenclature helps in selecting alternatives: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **20:** Series identifier. * **H:** High-performance pin fin geometry. * **80:** Specific dimension/height code. * **C2:** Blue Anodized finish with Push-Pin attachment. * **R0:** ROHS compliant and standard packaging.
    ✨ Follow-up Questions
    • ⤷ How does the thermal resistance of a pin fin heat sink compare to a straight fin heat sink?
    • ⤷ What is the recommended PCB hole diameter for the C2 push-pin attachment?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?