ATS-20H-80-C2-R0
AI

The **ATS-20H-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like BGA (Ball Grid Array) chips, CPUs, or GPUs.
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## 1. Technical Specifications
Below is a breakdown of the physical and thermal properties of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Part Number** | ATS-20H-80-C2-R0 |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (2-Pin) |
| **Footprint (L x W)** | 45mm x 45mm |
| **Height** | 25mm |
| **Thermal Resistance** | ~3.67°C/W (at 200 LFM) |
| **Spring Type** | Stainless Steel (R0 suffix) |
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## 2. Key Electronic Features
### A. Pin Fin Design
Unlike traditional straight-fin heat sinks, the "H" series uses a **cross-cut pin fin** geometry.
* **Omnidirectional Airflow:** It is ideal for systems where the direction of airflow is inconsistent or unknown.
* **Increased Surface Area:** The pin structure increases the total surface area for heat exchange without significantly increasing the footprint.
### B. Push-Pin Attachment
The **C2** designation refers to the attachment mechanism.
* It uses a plastic push-pin with a built-in spring.
* The spring provides **precise pressure** (Load) on the electronic component, ensuring maximum thermal contact without damaging the delicate silicon die.
### C. Thermal Interface Material (TIM)
Most "R0" variants come pre-applied with a high-performance thermal interface material (like ATS-54) on the base. This fills microscopic air gaps between the heat sink and the chip to improve heat transfer.
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## 3. Application Use Cases
This part is typically found in the following electronic environments:
1. **Telecommunications:** High-speed routers and switches.
2. **Embedded Computing:** Industrial PC boards and motherboards.
3. **Power Electronics:** Voltage regulators or power modules that generate significant localized heat.
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## 4. Part Number Breakdown
Understanding the nomenclature helps in selecting alternatives:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **20:** Series identifier.
* **H:** High-performance pin fin geometry.
* **80:** Specific dimension/height code.
* **C2:** Blue Anodized finish with Push-Pin attachment.
* **R0:** ROHS compliant and standard packaging.
- ⤷
How does the thermal resistance of a pin fin heat sink compare to a straight fin heat sink?
- ⤷ What is the recommended PCB hole diameter for the C2 push-pin attachment?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied TIM?