The **ATS-20H-98-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### Technical Specifications | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 15.31°C/W (at 100 LFM / 0.5 m/s) | | **Weight** | ~40 grams | --- ### Key Design Features 1. **Fin Profile (Cross-Cut):** The "98" in the part number refers to a specific fin configuration. Cross-cut patterns allow for multi-directional airflow, making the heat sink efficient regardless of the direction the cooling fan is blowing. 2. **Push-Pin Attachment:** The part uses a spring-loaded push-pin mechanism. This provides: * **Consistent Pressure:** Ensures the base of the heat sink maintains firm contact with the electronic chip. * **Secure Mounting:** Reduces the risk of the heat sink shifting during vibration or shipping. 3. **Material and Coating:** Constructed from Aluminum 6063 for high thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it increases surface emissivity and provides corrosion resistance. --- ### Component Dimensions (Physical) | Dimension | Measurement (mm) | | :--- | :--- | | **Length (Width)** | 45.00 mm | | **Breadth** | 45.00 mm | | **Height** | 15.00 mm | | **Pitch (Hole-to-Hole)** | 38.00 mm | --- ### Typical Applications * **Embedded Systems:** Cooling for industrial PC processors. * **Networking Hardware:** Dissipating heat from routers or switch chipsets. * **Power Electronics:** Cooling MOSFETs or voltage regulators in high-density power supplies. ---