The **ATS-21D-36-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is designed for high-power electronic cooling. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Product Type** | Heat Sink (BGA/Chipset) | | **Material** | Aluminum (Black Anodized) | | **Thermal Resistance** | 1.48 °C/W (at 200 LFM) | | **Dimensions** | 36.83mm x 36.83mm | | **Height** | 22.86mm | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Thermal Interface Material (TIM)** | T766 (High performance) | --- ## 2. Key Design Features ### A. maxiFLOW™ Geometry The part features a unique "flared fin" structure. This design increases the surface area for heat dissipation while maintaining a low pressure drop, making it highly efficient for forced-convection (fan-cooled) environments. ### B. pushPIN™ Attachment System Instead of simple adhesive tape, this part uses the **pushPIN™** system. * **Secure Mounting:** Uses pre-installed springs and pins to provide consistent pressure on the processor. * **Reliability:** Ensures the heat sink does not shift during vibration or shipping. * **Compatibility:** Designed for PCB holes with specific diameters (usually 3.0mm). ### C. Thermal Interface Material (TIM) The "C2" suffix indicates that the part comes pre-applied with **ATS T766** thermal grease. This eliminates the need for manual application and ensures optimal thermal contact between the component and the heat sink. --- ## 3. Typical Applications This specific heat sink size (36x36mm) is standard for various integrated circuits (ICs): 1. **BGA Packages:** Large Ball Grid Array processors. 2. **FPGA/ASIC:** High-speed field-programmable gate arrays. 3. **Network Switches:** Cooling for high-traffic networking chips. 4. **Power Supplies:** Heat dissipation for power MOSFETs or VRMs. --- ## 4. Ordering/Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **21D:** Design Series (maxiFLOW™) * **36:** Size (approx 36mm) * **C2:** High-performance thermal interface material (T766) * **R0:** Revision/Standard packaging code