The **ATS-21D-60-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is designed to provide low thermal resistance and high airflow efficiency. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Family** | maxiFLOW™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 1.45°C/W (at 200 LFM) | | **Flow Direction** | Directional (High-performance fin pattern) | --- ### 2. Key Design Features * **Fin Geometry:** The "maxiFLOW" design uses a tapered fin structure that increases the surface area while minimizing the pressure drop. This allows more air to pass through the sink, carrying away heat more effectively than standard extruded heat sinks. * **pushPIN™ Attachment:** This model uses a hardware-based attachment system rather than adhesive. This ensures a secure, high-pressure fit against the electronic component (like a CPU, FPGA, or GPU), which optimizes the thermal interface. * **C2-R0 Material Coding:** * **C2:** Refers to the specific thermal interface material (TIM) or finish/color (Blue Anodized). * **R0:** Typically indicates the revision or specific packaging compliance (RoHS compliant). --- ### 3. Electronic Application This heat sink is used to dissipate heat from high-power semiconductors. Common applications include: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but heat generation is high. 3. **Power Electronics:** Voltage regulators or motor drivers. 4. **Computing:** Cooling chipsets or localized hot spots on a motherboard. --- ### 4. Thermal Performance Table Thermal resistance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 1.45 | | 300 (1.5 m/s) | 1.20 | | 400 (2.0 m/s) | 1.05 | | 500 (2.5 m/s) | 0.95 |