The **ATS-21F-18-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed for cooling high-power electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm | | **Thermal Resistance** | 6.54 °C/W (at 1.0 m/s flow) | | **Fin Style** | Straight (maxiFLOW™) | | **Pressure Drop** | 0.49 inH2O (at 1.0 m/s) | --- ### 2. Key Component Features #### A. The maxiFLOW™ Design The "F" in the part number denotes the **maxiFLOW™** geometry. Unlike standard square fins, these have a flared fin structure. This design: * Reduces pressure drop. * Increases the surface area for heat dissipation. * Optimizes airflow in constrained spaces. #### B. pushPIN™ Attachment The "21" prefix refers to the specific attachment system. This part uses a **pushPIN™** mechanism (spring-loaded pins), which offers several advantages: * **Constant Pressure:** Ensures a reliable interface between the heat sink and the electronic component (TIM - Thermal Interface Material). * **Easy Installation:** Requires pre-drilled holes in the PCB for a tool-free or simple tool-assisted snap-in. #### C. Thermal Interface Material (TIM) The **C2** designation indicates that the heat sink comes pre-applied with **T766 phase-change material**. This eliminates the need for manual thermal paste application and ensures high thermal conductivity between the chip and the aluminum base. --- ### 3. Part Number Decoder | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **21** | Attachment series (pushPIN™) | | **F** | Fin Pattern (maxiFLOW™) | | **18** | Specific Size/Flow Category | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Application Context This part is typically used in: * **Networking Equipment:** Switches and routers where high-velocity airflow is present. * **Embedded Systems:** Industrial PCs requiring low-profile cooling (15mm height). * **Power Supplies:** Cooling MOSFETs or power ICs.