The **ATS-51250R-C1-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" product line, specifically designed to cool electronic components such as CPUs, GPUs, FPGAs, and ASICs. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Product Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 25mm x 25mm | | **Height** | 24.5mm | | **Thermal Resistance** | 2.50°C/W (at 200 LFM) | | **Color** | Blue Anodized | | **TIM (Thermal Interface Material)** | Pre-applied phase change material (T766) | --- ### 2. Key Design Features * **maxiFLOW™ Fin Geometry:** The heat sink features a unique tapered fin design that maximizes surface area for heat dissipation while increasing air turbulence. This ensures higher thermal efficiency compared to standard square-fin heat sinks. * **pushPIN™ Attachment:** It utilizes a specialized spring-loaded mechanism that ensures a secure, consistent pressure on the electronic package, which is critical for maintaining effective thermal contact. * **Integrated TIM:** The unit comes with **T766 thermal interface material** pre-applied to the base. This simplifies assembly and ensures optimal heat transfer from the chip to the aluminum fins without needing additional thermal paste. * **Material and Coating:** Made of lightweight aluminum with a blue anodized finish. The anodizing provides corrosion resistance and a slight increase in surface emissivity. --- ### 3. Typical Applications This specific part is often found in high-density electronic environments where airflow is present but space is limited. Common use cases include: 1. **Telecommunications:** Networking switches and routers. 2. **Industrial PCs:** Compact embedded systems. 3. **Computing:** Voltage regulator modules or small-form-factor processors. --- ### 4. Thermal Performance Overview Thermal resistance is the measure of how well the part moves heat away from the component. For the ATS-51250R-C1-R0, the performance varies based on airflow: * **@ 200 LFM (Linear Feet per Minute):** ~2.50 °C/W * **@ 400 LFM:** ~1.80 °C/W * **@ 600 LFM:** ~1.50 °C/W