The **ATS-51350D-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-51350D-C1-R0 | | **Dimensions** | 35mm x 35mm x 9.5mm | | **Material** | Aluminum (Black Anodized) | | **Thermal Resistance** | 5.2 °C/W (at 200 LFM) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Interface Material** | T766 (Thermal Tape/Pad) | --- ### 2. Key Design Features * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that maximizes surface area for radiant cooling and improves airflow through the fin field. * **maxiGRIP™ Attachment:** It uses a high-performance plastic frame clip that snaps around the component. This allows for: * **Secure Mounting:** High pressure for optimal thermal interface contact. * **Removability:** Easy to detach for maintenance without damaging the PCB. * **No Holes Required:** It does not require pre-drilled holes in the motherboard/PCB. * **Thermal Interface Material (TIM):** Pre-applied with **T766**, a high-performance thermal phase-change material that ensures minimal thermal resistance between the component and the heat sink. --- ### 3. Electronic Applications This part is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed network processors and switches. 2. **Data Centers:** Managing heat in server-grade power management units. 3. **Embedded Systems:** Industrial computers where space is limited but heat dissipation is critical (low-profile height of 9.5mm). 4. **Power Electronics:** Cooling of Voltage Regulator Modules (VRMs) or high-frequency MOSFETs. --- ### 4. Thermal Performance Data Performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 5.2 | | 300 | 1.5 | 4.1 | | 400 | 2.0 | 3.5 | | 500 | 2.5 | 3.1 |