ATS-53325B-C1-R0
AI

The **ATS-53325B-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, which is specifically engineered to handle the thermal demands of high-heat-generating electronic components like processors, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table summarizes the key physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum (Black Anodized) |
| **Dimensions (L x W x H)** | 32.2mm x 32.2mm x 7.6mm |
| **Thermal Resistance** | 5.30° C/W (at 200 LFM) |
| **Attachment Method** | maxiGRIP™ (Frame Clip) |
| **Interface Material** | T766 (Thermal Tape) |
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### 2. Key Design Components
#### A. maxiFLOW™ Fin Geometry
The "B" in the part number indicates the specific fin profile. These heat sinks feature a unique spread-fin design that maximizes surface area while reducing pressure drop. This allows for better airflow through the fins, making it highly efficient in forced-air environments.
#### B. maxiGRIP™ Attachment System
This part uses a specialized mechanical attachment system:
* **Plastic Frame Clip:** A high-tension clip that fits around the component.
* **Stainless Steel Spring Clip:** Applies steady, even pressure across the center of the heat sink to the component, ensuring optimal thermal contact.
* **Benefits:** It eliminates the need to drill holes in the PCB and allows the heat sink to be detached and reattached during maintenance.
#### C. Thermal Interface Material (TIM)
The **-C1** designation refers to the pre-applied thermal interface. This model usually comes with **T766**, a high-performance thermal tape that provides a low-resistance path for heat to move from the chip into the aluminum fins.
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### 3. Applications
The ATS-53325B-C1-R0 is typically found in:
* **Telecommunications:** Networking switches and routers.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Electronics:** Cooling for high-efficiency voltage regulators.
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### 4. Part Number Breakdown
`ATS-53325B-C1-R0`
* **ATS:** Manufacturer Prefix.
* **53325:** Model Series/Specific Dimensions.
* **B:** Fin pattern/profile type.
* **C1:** Thermal Interface Material (TIM) type.
* **R0:** Revision/RoHS compliance status.
- ⤷
What are the airflow requirements to achieve the rated 5.30° C/W thermal resistance?
- ⤷ How does the maxiGRIP attachment compare to standard push-pin mounting?
- ⤷ Are there alternative thermal interface materials available for this specific heat sink?