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  • ATS-53325B-C1-R0

  • AI
    The **ATS-53325B-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, which is specifically engineered to handle the thermal demands of high-heat-generating electronic components like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 32.2mm x 32.2mm x 7.6mm | | **Thermal Resistance** | 5.30° C/W (at 200 LFM) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Design Components #### A. maxiFLOW™ Fin Geometry The "B" in the part number indicates the specific fin profile. These heat sinks feature a unique spread-fin design that maximizes surface area while reducing pressure drop. This allows for better airflow through the fins, making it highly efficient in forced-air environments. #### B. maxiGRIP™ Attachment System This part uses a specialized mechanical attachment system: * **Plastic Frame Clip:** A high-tension clip that fits around the component. * **Stainless Steel Spring Clip:** Applies steady, even pressure across the center of the heat sink to the component, ensuring optimal thermal contact. * **Benefits:** It eliminates the need to drill holes in the PCB and allows the heat sink to be detached and reattached during maintenance. #### C. Thermal Interface Material (TIM) The **-C1** designation refers to the pre-applied thermal interface. This model usually comes with **T766**, a high-performance thermal tape that provides a low-resistance path for heat to move from the chip into the aluminum fins. --- ### 3. Applications The ATS-53325B-C1-R0 is typically found in: * **Telecommunications:** Networking switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Cooling for high-efficiency voltage regulators. --- ### 4. Part Number Breakdown `ATS-53325B-C1-R0` * **ATS:** Manufacturer Prefix. * **53325:** Model Series/Specific Dimensions. * **B:** Fin pattern/profile type. * **C1:** Thermal Interface Material (TIM) type. * **R0:** Revision/RoHS compliance status.
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve the rated 5.30° C/W thermal resistance?
    • ⤷ How does the maxiGRIP attachment compare to standard push-pin mounting?
    • ⤷ Are there alternative thermal interface materials available for this specific heat sink?