The **ATS-55400R-C1-R0** is a high-performance thermal management component, specifically a **Heat Sink** from Advanced Thermal Solutions (ATS). It is part of their "maxiFLOW™" product line, designed to dissipate heat from electronic components like BGA (Ball Grid Array) packages. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions** | 40mm x 40mm x 24.5mm | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.3 °C/W @ 200 LFM | | **Attachment Method** | maxiGRIP™ (Frame Clip) | --- ### 2. Key Design Features #### A. maxiFLOW™ Fin Geometry Unlike standard square-cut fins, the maxiFLOW design features a flared fin structure. This geometry is engineered to: * Increase surface area for better heat radiation. * Maximize airflow intake from multiple directions. * Reduce pressure drop across the heat sink. #### B. maxiGRIP™ Attachment System The "R-C1" designation typically refers to the attachment mechanism. The maxiGRIP system uses: 1. **Plastic Frame Clip:** Replaces messy adhesives or thermal tapes. 2. **Stainless Steel Spring Clip:** Provides consistent, high-pressure contact between the heat sink and the component. 3. **Ease of Maintenance:** Allows for the heat sink to be removed and reattached without damaging the PCB. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number usually signifies that the part comes with a pre-applied **Thermal Interface Material**. This ensures low thermal resistance at the boundary between the chip and the aluminum base. --- ### 3. Common Applications This specific size (40mm x 40mm) is commonly used to cool: * **Processors (CPUs/GPUs):** Integrated circuits in embedded systems. * **FPGAs:** High-gate-count field-programmable gate arrays. * **Telecommunications:** Network switches and routers where high-density heat is an issue. ---