The **ATS-H1-46-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, and ASICs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Anodized) | | **Attachment Method** | Push-Pin (2-Pin) | | **Dimensions (L x W x H)** | 41.00mm x 45.00mm x 25.00mm | | **Thermal Resistance** | 1.83°C/W (at 200 LFM) | | **Fin Style** | Tapered / High-Performance maxiFLOW™ | | **RoHS Status** | Compliant | --- ### 2. Key Electronic Features #### A. Thermal Performance The "C2" in the part number indicates a specific thermal interface material (TIM) or performance grade. This heat sink is engineered to reduce the junction temperature of semiconductors, preventing **thermal throttling** and extending the lifespan of the electronic device. #### B. The maxiFLOW™ Design Unlike standard extruded heat sinks, the maxiFLOW™ geometry features a flared fin structure. * **Airflow Efficiency:** It maximizes the surface area for radiant and convective cooling. * **Low Pressure Drop:** The design allows air to pass through with minimal resistance, making it ideal for high-density PCB layouts where airflow may be obstructed. #### C. Mechanical Attachment (Push-Pin) The part uses a **Push-Pin and Brass Spring** mechanism: * **Reliability:** Provides consistent pressure on the component to ensure maximum contact with the Thermal Interface Material (TIM). * **Assembly:** Designed for quick installation onto pre-drilled holes in the PCB. --- ### 3. Application Examples This specific component is typically used in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Voltage regulators and power modules that generate significant heat in a small footprint. ---