The **ATS-H1-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high thermal performance in tight spaces with low pressure drops. --- ### 1. Technical Specifications The following table outlines the key electrical and physical parameters of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Type** | Top Mount Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.51° C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 41.42mm x 45.10mm x 22.86mm | --- ### 2. Key Features and Design This part is engineered for high-density electronic cooling. Its design features include: * **Tapered Fin Design:** The "maxiFLOW" geometry features a spread-fin pattern that increases surface area while maximizing airflow through the fin field. * **pushPIN™ Attachment:** It utilizes a specialized spring-loaded mechanism that ensures consistent pressure on the electronic component (CPU, GPU, or ASIC), improving thermal interface efficiency. * **Material properties:** Made from aluminum for a balance of weight and thermal conductivity. The blue anodized coating prevents corrosion and provides a professional finish. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material or similar high-performance thermal pads to ensure low contact resistance. --- ### 3. Applications in Electronics The ATS-H1-71-C2-R0 is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed networking chips and line cards. 2. **Embedded Systems:** Heat dissipation for industrial PC processors. 3. **Power Electronics:** Managing heat for MOSFET arrays or power converters. 4. **Data Centers:** High-airflow server environments where vertical clearance is limited. --- ### 4. Thermal Performance Comparison The performance of this heat sink varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 2.51 | | 300 (1.5 m/s) | 1.81 | | 400 (2.0 m/s) | 1.45 | | 500 (2.5 m/s) | 1.23 |