CI160808-R12J
AI

The **CI160808-R12J** is a surface-mount multilayer chip inductor, commonly used in high-frequency circuit applications. This part follows standard naming conventions used by manufacturers like Bourns or TDK.
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### 1. Part Number Breakdown
Understanding the alphanumeric code reveals the physical and electrical specifications of the component:
| Segment | Meaning | Specification |
| :--- | :--- | :--- |
| **CI** | Product Series | Chip Inductor (Multilayer type) |
| **160808** | Case Size (EIA 0603) | 1.6mm x 0.8mm x 0.8mm |
| **R12** | Inductance Value | 0.12 µH (120 nH) |
| **J** | Tolerance | ±5% |
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### 2. Technical Specifications
Typical characteristics for this class of multilayer inductor include:
* **Inductance:** 120 nH (Nanohenries).
* **Quality Factor (Q):** Usually ranges between 10 and 15 at a specific test frequency (e.g., 50 MHz).
* **Self-Resonant Frequency (SRF):** Typically high, often above 500 MHz, making it suitable for RF filtering.
* **Rated Current:** Usually in the range of 100mA to 300mA.
* **DC Resistance (DCR):** Generally ranges from 0.5Ω to 1.2Ω.
* **Operating Temperature:** Typically -55°C to +125°C.
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### 3. Key Features & Construction
* **Multilayer Technology:** Unlike wire-wound inductors, these are constructed by layering ceramic materials and internal electrodes. This results in a monolithic, shielded structure.
* **Magnetic Shielding:** The closed magnetic circuit minimizes crosstalk and electromagnetic interference (EMI) with neighboring components.
* **High Reliability:** The solid construction provides excellent physical resistance to heat and mechanical shocks during the soldering process.
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### 4. Common Applications
These inductors are found in compact electronic devices where space is at a premium:
1. **Mobile Communication:** Cell phones, pagers, and GPS modules.
2. **RF Circuits:** Used in high-frequency oscillators, impedance matching networks, and filters.
3. **EMI Suppression:** Filtering high-frequency noise in signal lines.
4. **WLAN/Bluetooth:** Found in wireless networking hardware for signal integrity.
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- ⤷
What is the difference between a multilayer chip inductor and a wire-wound inductor?
- ⤷ How do I calculate the resonant frequency for this specific inductor in a circuit?
- ⤷ Can this part be used in power supply decoupling applications?