The **CTX110603-R** is a high-performance, surface-mount (SMD) power inductor commonly used in DC-DC converters and power management modules. It is part of a specialized series often designed for high-current applications and server-grade power supplies. --- ### 1. Key Technical Specifications The following table summarizes the typical electrical and physical characteristics of this component: | Parameter | Specification (Typical) | | :--- | :--- | | **Inductance** | ~0.33 µH to 1.0 µH (Series dependent) | | **Current Rating (Irms)** | High (Often 30A - 60A+) | | **DC Resistance (DCR)** | Ultra-low (Typically < 1.0 mΩ) | | **Mounting Type** | Surface Mount (SMD/SMT) | | **Core Material** | Ferrite or Powdered Iron | | **Operating Temp** | -40°C to +125°C | --- ### 2. Core Features * **High Current Density:** Designed to handle massive amounts of current with minimal heat generation due to its exceptionally low DCR. * **Low Profile:** The "1106" in the part number often refers to the physical footprint (approximately 11mm x 6mm or similar, depending on the manufacturer's coding), making it suitable for dense PCB layouts. * **Magnetically Shielded:** Most inductors in this class are shielded to minimize Electromagnetic Interference (EMI), which is critical for sensitive electronics. * **RoHS Compliant:** The "-R" suffix typically denotes compliance with RoHS (Restriction of Hazardous Substances) standards. --- ### 3. Common Applications This part is specifically engineered for high-frequency switching environments: 1. **Voltage Regulator Modules (VRM):** Used in CPU/GPU power delivery on motherboards. 2. **Point-of-Load (POL) Converters:** Essential for stepping down voltage for FPGAs and ASICs. 3. **Data Centers:** Powering high-speed servers and networking hardware. 4. **Distributed Power Systems:** Integrated into modular power supplies. --- ### 4. Identification and Sourcing The **CTX** prefix is frequently associated with brands like **Eaton (formerly Cooper Bussmann/Coiltronics)**. When replacing this part, it is vital to match: * **Saturation Current ($I_{sat}$):** The point where inductance drops. * **Footprint:** Ensure the solder pad layout matches the original PCB design.