The **GF200-0UG-014B** typically refers to a specialized glass-to-metal seal or a specific connector component often used in vacuum technology, sensors, or high-pressure hermetic packaging. Based on industrial nomenclature, this part belongs to the category of **hermetic feedthroughs**. Below is a breakdown of its electronic and physical characteristics: --- ### 1. Component Overview This component acts as an interface that allows electrical signals or power to pass through a sealed chamber (like a vacuum or pressure vessel) without compromising the environment's integrity. | Feature | Specification Details | | :--- | :--- | | **Part Type** | Hermetic Glass-to-Metal Seal / Feedthrough | | **Body Material** | Often Kovar or Stainless Steel (for thermal expansion matching) | | **Insulator** | Borosilicate Glass or Ceramic | | **Pin Material** | Gold-plated Nickel or Kovar pins | | **Seal Type** | Compression or Matched Seal | --- ### 2. Key Electronic Properties The "Electronic Parts" aspect focuses on the pins and the insulation that facilitates signal transmission. * **Pin Configuration:** Usually features a multi-pin layout (the "014" often indicates a specific pin count or geometric configuration in manufacturer catalogs). * **Conductivity:** The pins are treated with high-purity plating (often **Gold per MIL-G-45204**) to ensure low contact resistance and prevent oxidation. * **Insulation Resistance (IR):** The glass-to-metal interface provides extremely high electrical isolation, typically rated in the **Giga-ohm (GΩ)** range at 500V DC. * **Dielectric Withstanding Voltage:** Designed to handle high voltage spikes without arcing between the pins or the housing. --- ### 3. Structural Components The "Parts" within this assembly include: 1. **The Outer Ring (Header):** A metal shell that is either soldered, welded, or O-ring sealed into a larger assembly. 2. **The Pins (Leads):** These are the conductors that carry the electrical current. They are rigid and designed for soldering or plug-in connections. 3. **The Glass Preform:** This is melted to bond the pins to the header, creating a vacuum-tight electronic barrier. --- ### 4. Common Applications Due to its robust electronic sealing, it is used in: * **Lithography Equipment:** Providing power to sensors inside vacuum chambers. * **Aerospace:** Sensors in jet engines or fuel systems. * **Medical:** Hermetically sealed implants or diagnostic tools. ---