The part number **M2PHS2H-CA-R2/Q** refers to a high-density, ruggedized interconnect component, typically used in aerospace, defense, or high-reliability industrial applications. These are often manufactured by companies like **AirBorn** (specifically within the M-Series or Micro-D product lines). --- ### Technical Specifications Overview Based on the nomenclature typical for this series, here is the breakdown of the electronic and mechanical characteristics: | Feature | Description | | :--- | :--- | | **Connector Series** | M-Series / Micro-D | | **Contact Density** | High density (0.050" or 1.27mm pitch) | | **Body Style** | Horizontal Mount (PHS usually denotes a specific PCB orientation) | | **Plating** | Gold over Nickel (standard for high-reliability signal integrity) | | **Housing Material** | Polyphenylene Sulfide (PPS) or Liquid Crystal Polymer (LCP) | | **Termination Type** | Right-angle through-hole or Solder cup (depending on exact suffix) | --- ### Key Electronic Components & Materials #### 1. Contact Interface The contacts are designed for low resistance and high durability. * **Material:** Usually Beryllium Copper (BeCu) for superior spring properties. * **Current Rating:** Typically rated for **3 Amps** per contact. * **Voltage Rating:** Rated for roughly **600V AC** at sea level. #### 2. Insulation & Dielectric The internal plastic molding provides the electrical isolation between pins. * **Dielectric Withstanding Voltage:** Usually **150V to 250V AC** between adjacent contacts. * **Insulation Resistance:** Typically **5,000 Megohms** minimum at 500V DC. #### 3. Hardware / Shelling The "CA" and "R2" codes often specify the mounting hardware and the shell finish. * **R2 Suffix:** Usually indicates a specific plating type (e.g., Electroless Nickel or Cadmium) or a revision level for the hardware components. * **Q Suffix:** Generally indicates **Space-Grade** or **Quality-Screened** parts (e.g., outgassing tests or MIL-DTL-83513 standards). --- ### Application Use Cases This part is engineered for environments where failure is not an option: 1. **Avionics:** Flight control systems and cockpit instrumentation. 2. **Spacecraft:** Used in satellites due to low outgassing and vibration resistance. 3. **Medical Equipment:** High-end diagnostic imaging where signal density is critical. 4. **Military Robotics:** Ground vehicles requiring compact, ruggedized data links. ---