The **M2PHSH-A1D-R2** is a specific part number typically associated with high-density, high-speed board-to-board connectors. This series is commonly utilized in telecommunications, servers, and industrial computing applications where space-saving and signal integrity are paramount. --- ### 1. Technical Specifications Overview Below is a breakdown of the typical characteristics for this electronic component: | Parameter | Specification | | :--- | :--- | | **Component Type** | Board-to-Board (Mezzanine) Connector | | **Pitch** | 0.5mm to 1.0mm (Series dependent) | | **Mounting Type** | Surface Mount (SMT) | | **Gender** | Header (Male) | | **Number of Rows** | Dual Row (2-Row) | | **Contact Plating** | Gold (typically 10-30μ") over Nickel | | **Lead-Free Status** | RoHS Compliant | --- ### 2. Part Number Breakdown While manufacturer codes vary slightly, the nomenclature "M2PHSH-A1D-R2" usually decodes as follows: * **M2PH:** Refers to the series family (Micro-Pitch High Speed). * **SH:** Indicates a "Shielded" or "Shrouded" design to prevent electromagnetic interference (EMI) and protect pins. * **A1D:** Specifies the pin count and orientation (Standard vertical or right-angle). * **R2:** Packaging designation, usually indicating **Tape & Reel** (R) for automated pick-and-place assembly. --- ### 3. Key Electronic Features * **High Signal Integrity:** Designed to handle high-frequency signals with minimal crosstalk, making it suitable for PCIe or SATA interfaces. * **Blind Mating:** Often features chamfered edges or polarizing "bosses" to ensure the connector aligns correctly even when the operator cannot see the mating point. * **Durability:** Gold plating on the contacts ensures low contact resistance and high durability over multiple mating cycles (typically 50–100 cycles). --- ### 4. Common Applications This part is frequently found in the following hardware: 1. **Industrial PCs:** Connecting CPU boards to I/O expansion boards. 2. **Network Switches:** Used in backplanes for high-speed data routing. 3. **Medical Imaging:** High-density signal transmission in compact diagnostic tools. 4. **Embedded Modules:** Connecting System-on-Modules (SoM) to carrier boards. ---