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  • OVM9724-RADA

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    ## OVM9724-RADA Electronic Components Overview The **OVM9724-RADA** is a highly integrated **CameraCubeChip™** module produced by OmniVision Technologies. It is essentially a complete camera-on-a-chip solution, combining the image sensor, lens, and signal processing into a microscopic, reflowable package. --- ### 1. Key Technical Specifications The following table highlights the primary electronic and optical characteristics of the OVM9724-RADA: | Parameter | Specification | | :--- | :--- | | **Resolution** | 1280 x 720 (720p HD) | | **Pixel Size** | 1.4 µm x 1.4 µm | | **Optical Format** | 1/9-inch | | **Interface** | 1-lane MIPI serial output | | **Max Frame Rate** | 30 fps at 720p | | **Power Supply** | Core: 1.5V, Analog: 2.8V, I/O: 1.8V | | **Package Type** | RADA (Reflowable, Back-side illuminated) | --- ### 2. Core Electronic Components The module is composed of three primary functional layers integrated into a single 3D structure: #### A. CMOS Image Sensor (OmniBSI™-2) The heart of the module is the **OV9724** die. It uses OmniVision's proprietary **Back-Side Illumination (BSI)** technology. * **BSI Advantage:** Unlike traditional front-side sensors, BSI moves the metal circuitry behind the photodiode layer. This allows more light to reach the pixels, significantly improving low-light performance and reducing noise. #### B. Integrated Signal Processor (ISP) The module includes on-chip processing functions that handle raw data before it is sent to the host processor. These include: * **AEC/AGC:** Automatic Exposure Control and Gain Control. * **White Balance:** Automatic White Balance (AWB). * **Defective Pixel Correction:** Automatically masks physical manufacturing flaws in the sensor grid. * **Digital Video Port:** Converts analog signals into digital MIPI (Mobile Industry Processor Interface) data. #### C. Optical Lens Stack Unlike standard sensors where the lens is a separate component, the "CameraCubeChip" technology uses a **Wafer-Level Optic (WLO)**. * The lens is fabricated directly on the wafer, ensuring perfect alignment with the sensor and allowing the entire module to be soldered to a PCB like a standard surface-mount component. --- ### 3. Connection and Interface Details The OVM9724-RADA communicates via two primary paths: 1. **MIPI Interface:** A high-speed, low-power differential serial bus used to transmit the actual video data. 2. **SCCB Interface:** (Serial Camera Control Bus) A two-wire I2C-compatible interface used to program the camera registers (e.g., changing brightness, frame rate, or sleep modes). --- ### 4. Application Use Cases Due to its ultra-thin profile (height of ~2.5mm), it is primarily used in: * **Mobile Devices:** Front-facing cameras in ultra-slim smartphones and tablets. * **Laptops:** Embedded webcams in thin-bezel displays. * **Wearables:** Smart glasses or compact IoT devices.
    ✨ Follow-up Questions
    • What are the power consumption levels for the OVM9724 during active streaming?
    • How does Wafer-Level Optics differ from traditional lens assemblies in terms of durability?
    • Which specific MIPI clock speed is required for 720p at 30fps?