The **SRP2010TMA-R56M** is a high-current, shielded power inductor manufactured by Bourns. It is part of the SRP2010TMA series, which is specifically designed for automotive applications and high-density power conversions. --- ### Technical Specifications The following table highlights the primary electrical and physical characteristics of the component: | Parameter | Specification | Details | | :--- | :--- | :--- | | **Inductance** | 0.56 µH | Measured at 100 kHz / 1V | | **Tolerance** | ±20% | Standard for power inductors | | **Current Rating (Irms)** | 3.5 A | Current causing 40°C temperature rise | | **Saturation Current (Isat)** | 5.3 A | Current causing 30% drop in inductance | | **DC Resistance (DCR)** | 34 mΩ (Typ) / 41 mΩ (Max) | Affects power efficiency | | **Operating Temp** | -55°C to +150°C | Includes self-heating | | **Case Size** | 2010 (Metric 2012) | 2.0 x 1.2 x 1.0 mm | | **Qualification** | AEC-Q200 | Automotive grade reliability | --- ### Core Construction & Features #### 1. Metal Alloy Core Unlike traditional ferrite inductors, the "TMA" series uses a **metal alloy powder core**. This construction offers: * **Soft Saturation:** The inductance drops gradually as current increases, rather than a sharp "cliff" characteristic of ferrite cores. * **High Saturation Current:** Allows for higher power density in a small footprint. #### 2. Magnetic Shielding The inductor is fully shielded, which minimizes **Electromagnetic Interference (EMI)**. This is critical in sensitive automotive electronics where noise can interfere with sensors or communication modules. #### 3. Flat Wire/Molded Construction The component utilizes a molded construction which provides high resistance to mechanical shock and vibration, meeting the rigorous demands of under-the-hood or in-cabin automotive environments. --- ### Common Applications * **Automotive Systems:** Driver assistance (ADAS), infotainment, and lighting. * **DC/DC Converters:** Point-of-Load (POL) power supplies for CPUs and FPGAs. * **Mobile Electronics:** Slim smartphones or tablets where height (1.0 mm) is a constraint.