The **TPC-315-R853A** is an industrial-grade Touch Panel PC designed by Advantech. It is built for HMI (Human Machine Interface) applications in harsh environments. Below is a detailed breakdown of its electronic components and technical specifications. --- ### 1. Core Computing Architecture The system is powered by the **Intel Atom® x6000E Series** (Elkhart Lake) platform, which balances low power consumption with industrial-level performance. | Component | Specification | | :--- | :--- | | **CPU** | Intel Atom® x6413E (Quad-core, 1.50 GHz base, up to 3.00 GHz) | | **Memory** | 1 x SO-DIMM DDR4 slot (Supports up to 32GB, 3200 MHz) | | **Graphics** | Intel® UHD Graphics for 10th Gen Intel® Processors | | **Watchdog Timer** | 1 ~ 255 sec/min programmable | --- ### 2. Display and Touch Electronics The "315" in the model name refers to the **15-inch** display size. This unit utilizes a resistive touch interface, ideal for operators wearing gloves. * **LCD Panel:** * **Resolution:** 1024 x 768 (XGA) * **Luminance:** 300 cd/m² * **Backlight:** LED (50,000-hour life span) * **Touch Controller:** * **Type:** 5-wire Analog Resistive * **Light Transmission:** 80% ± 3% * **Durability:** 36 million touches at a single point. --- ### 3. I/O Connectivity & Electronic Interfaces The electronic board supports a variety of industrial communication protocols. | Interface Type | Quantity | Details | | :--- | :--- | :--- | | **Ethernet** | 2 | 10/100/1000 Mbps (Intel i210/i211) | | **USB** | 4 | 2 x USB 3.2 (Gen 2), 2 x USB 2.0 | | **Serial Ports** | 2 | 1 x RS-232, 1 x RS-232/422/485 | | **Video Out** | 1 | HDMI 1.4 (for secondary display support) | | **Storage** | 1 | M.2 (B Key) 2242/3042/2280 SATA or NVMe | --- ### 4. Power Supply and Thermal Management Because this is an industrial device, the power electronics are designed for stability against voltage spikes and noise. * **Input Voltage:** 24VDC ± 20% * **Power Consumption:** 23W (Typical) / 45W (Max) * **Cooling System:** Fanless design. The electronics use the aluminum alloy chassis as a heat sink to prevent dust ingress and mechanical failure. * **Protection:** Reverse polarity protection and overvoltage protection. --- ### 5. Expansion Capabilities The internal PCB includes expansion slots to add wireless communication or specialized industrial fieldbus modules: * **M.2 B Key:** Used for 5G, LTE, or SSD storage. * **M.2 E Key:** Used for Wi-Fi and Bluetooth modules. * **TPM 2.0:** Integrated hardware security chip for data encryption.