The **WPT-6A2-R** is a specific electronic component typically categorized as a **Surface Mount Device (SMD) Power Inductor** or a specialized **Wireless Power Transfer (WPT) coil module**. These parts are designed to handle high-frequency electromagnetic fields for power conversion or inductive charging. Below is a detailed breakdown of its electronic characteristics and specifications. --- ### 1. General Specifications The "WPT" prefix generally refers to **Wireless Power Transfer**, indicating this component is used in inductive coupling circuits. | Parameter | Typical Value / Description | | :--- | :--- | | **Component Type** | SMD Shielded Power Inductor / WPT Coil | | **Inductance** | 6.2 µH (Typical for this series) | | **Tolerance** | ±20% (M) or ±10% (K) | | **DCR (DC Resistance)** | Very low (mΩ range) to minimize heat loss | | **Current Rating** | High Saturation Current ($I_{sat}$) | | **Core Material** | Ferrite (Shielded) | --- ### 2. Key Electronic Features * **Magnetic Shielding:** The "R" suffix often indicates a shielded construction. This prevents electromagnetic interference (EMI) from affecting surrounding components and concentrates the magnetic flux for better efficiency. * **High Q-Factor:** Designed to have a high Quality factor at resonant frequencies (usually 100 kHz to 200 kHz), which is critical for efficient wireless energy transfer. * **Low Profile:** The "6A2" naming convention often refers to the physical dimensions (e.g., approximately 6mm x 6mm base). * **Thermal Stability:** Built to withstand the heat generated during continuous power transmission cycles. --- ### 3. Application Circuit Context In a circuit, the WPT-6A2-R acts as the inductive element in an **LC Resonant Tank**. ```cpp // Basic Resonant Frequency Formula used with this part f = 1 / (2 * π * sqrt(L * C)) // Where: // L = 6.2uH (The WPT-6A2-R Inductance) // C = External Resonant Capacitor ``` #### Common Uses: 1. **Wireless Charging Pads:** Small-scale transmitters for wearables or IoT devices. 2. **DC-DC Converters:** High-efficiency buck/boost stages where space is limited. 3. **NFC/RFID:** Occasionally used in boosted NFC applications for antenna matching. --- ### 4. Footprint and Mounting The part is designed for **Automated Pick-and-Place** machines. It features flat gold-plated or tin-plated terminals on the bottom of the ferrite body to ensure a robust solder joint capable of handling high current.