OVERVIEW
The EP7209 is a complete integrated system on a chip for enabling personal digital audio solutions. It is designed specifically for implementing audio processing algorithms in power sensitive applications. The core-logic functionality of the device is built around an ARM720T embedded processor.

FEATURES
■ Audio decoder system-on-chip
    — Allows for support of multiple audio decompression algorithms
    — Supports MPEG 1, 2, & 2.5 layer 3 audio decoding, including ISO compliant MPEG 1 & 2 layer 3 support for all standard sample rates and bit rates
    — Supports bit streams with adaptive bit rates
    — DAI (Digital Audio Interface) providing glueless interface to low power DACs, ADCs, and Codecs
■ Ultra low power consumption for MP3 playback
    — 87 mW (typical) for 44.1 kHz samples/sec, 128 kbits/second
    — 50 mW for 22.05 kHz samples/sec, 64 kbits/second
    — <1 mW in Standby State
■ ARM720T processor
    — ARM7TDMI CPU
    — 8 kbytes of four-way set-associative cache
    — MMU with 64-entry TLB (transition look-aside buffer)
    — Write Buffer
    — Windows® CE enabled
    — Thumb code support enabled
■ Dynamically programmable clock speeds of 18, 36, 49, and 74 MHz at 2.5 V
■ Performance matching 100 MHz Intel® Pentium-based PC
■ OEM customization
    — Integrated ARM720T RISC processor
    — Up to 25 MHz of CPU processing power available (after digital audio decoding) for custom features such as software EQ or tone control, volume control, spectrum analyzer, random play order, etc.
    — Allows for control of digital voice recorder function
■ LCD controller
    — Interfaces directly to a single-scan panel monochrome LCD
    — Panel width is programmable from 32 to 1024 pixels in 16-pixel increments
    — Video frame buffer size programmable up to 128 kbytes
    — Bits per pixel of 1, 2, or 4 bits
■ Memory controller
    — Decodes up to 6 separate memory segments of up to 256 Mbytes each
    — Each segment can be configured as 8, 16, or 32 bits wide and supports page-mode access
    — Programmable access time for conventional ROM/SRAM/FLASH memory
    — Supports Removable FLASH card interface
    — Enables connection to removable FLASH card for addition of expansion FLASH memory modules
■ 38,400 bytes (0x9600) of on-chip SRAM for fast program execution and/or as a frame buffer
■ On-chip boot ROM for manufacturing support
■ Integrated DAI interface
    — Connects directly to a Crystal® audio DAC
■ 27-bits of general-purpose I/O
    — Three 8-bit and one 3-bit GPIO port
    — Supports scanning keyboard matrix
■ SIR (up to 115.2 kbps) infrared encoder/decoder
    — IrDA (Infrared Data Association) SIR protocol encoder/decoder
■ DC-to-DC converter interface (PWM)
    — Provides two 96 kHz clock outputs with programmable duty ratio (from 1-in-16 to 15-in-16) that can be used to drive a DC to DC converter
■ 208-pin LQFP or 256-ball PBGA packages
■ Full JTAG boundary scan and Embedded ICE support