| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |
 National Semiconductor ... |
MTD48
|
62Kb / 1P |
48 Lead Molded Thin Shrink Small Outline Package, JEDEC
|
 Maxim Integrated Produc... |
21-0114B
|
58Kb / 1P |
PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE)
REV B |
 fujitsu semiconductor |
FPT-20P-M04
|
37Kb / 1P |
THIN SHRINK SMALL OUTLINE PACKAGE
|
 Dallas Semiconductor |
21-0102
|
109Kb / 2P |
PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM
|
 Maxim Integrated Produc... |
21-0140
|
59Kb / 2P |
PACKAGE OUTLINE, 16,20,28,32,40L THIN QFN, 5*5*0.75MM
REV .Q |
|
21-0141
|
104Kb / 2P |
PACKAGE OUTLINE, 36,40,48L THIN QFN, 6*6*0.75MM
Rev N |
|
21-0144
|
128Kb / 2P |
PACKAGE OUTLINE 32,44,48,56L THIN QFN, 7*7*0.75MM
REV .K |
|
21-0181
|
66Kb / 2P |
PACKAGE OUTLINE, 43L THIN QFN, 3.5*9*0.8MM
REV .C |
 ACCUTEK MICROCIRCUIT CO... |
AK08D300-TSOP
|
545Kb / 5P |
Thin Small Outline Package TSOP DIP Adapters
|
 Guangdong Youtai Semico... |
LM75B
|
312Kb / 23P |
plastic thin shrink small outline package; 8 leads;
|