Description
VD56G3 Bare die

Features
■ Global shutter technology, ST proprietary single layer
■ 3D stacked sensor 40 nm/65 nm
■ 2.61 µm x 2.61 µm BSI pixel with full DTI (deep trench isolation)
■ High-performance with excellent – QE (quantum efficiency) – MTF (modulation transfer function) up to near IR – Perfect PLS (shutter efficiency)
■ Smallest sensor on market with 1.5 Mpixel resolution – Compact die size: 3.6 mm x 4.3 mm – 1124 pixels x 1364 pixels – Very small pixel array, 2.9 mm x 3.6 mm – Optical format ¼ inch
■ Operating junction temperature: -30 °C to 85 °C
■ Dual lane transmitter MIPI CSI-2 (copyright© 2005-2010 MIPI Alliance, Inc. Standard for Camera Serial Interface 2 (CSI-2) version 1.0) version 1.3, 1.5 Gbps per lane
■ Fast mode+ I2C control interface
■ Integrated temperature sensor
■ Up to 100 fps (frames per second) at full resolution and 260 fps with VGA resolution
■ Programmable sequences of 4-frame contexts, including frame parameters
■ Automatic dark calibration
■ Dynamic and map-based defective correction
■ Embedded auto-exposure with 336 zone statistics
■ 8 multiple function IO, dynamically programmable with frame contexts (GPIO, strobe pulse, pulse-width modulation, V sync)
■ Up to 8 illumination control outputs synchronized with sensor integration periods and master/slave external frame start
■ Mirror/flip readout
■ Fully sequenceable with frame contexts
■ Crop
■ Binning (x2 and x4)
■ Sub sampling (x2 and x4)