GENERAL DESCRIPTION
The ADN46241 is a quad-channel, signal isolated, low voltage
differential signaling (LVDS) buffer that operates at up to 2.5 Gbps
with very low jitter. The device integrates Analog Devices, Inc.,
iCoupler® technology, enhanced for high speed operation to provide
drop-in galvanic isolation of LVDS signal chains. AC coupling
and/or level shifting to the LVDS receivers and from the LVDS
drivers allows isolation of other high speed signals such as current
mode logic (CML).
The ADN4624 includes a refresh mechanism to monitor the input
and output states and ensure they remain the same in the absence
of data transitions (for example, at power-on).
For lower power consumption and high speed operation with low
jitter, the LVDS and isolator circuits rely on 1.8 V supplies. The
ADN4624 is fully specified over a wide industrial temperature range
and is available in a 28-lead, wide-body, finer pitch SOIC_W_FP
package with 8.3 mm creepage and clearance (for 5.7 kV rms or 8
kVPEAK surge and impulse voltages and reinforced insulation at ac
mains voltages) or 6 mm × 6 mm LFCSP package with 1.27 mm
creepage and clearance (for basic/functional isolation).

FEATURES
► 5.7 kV rms and 1.5 kV rms LVDS isolators
► Complies with TIA/EIA-644-A LVDS signal levels
► Quad-channel configuration
► Any data rate up to 2.5 Gbps switching with low jitter
► 10 Gbps total bandwidth across four channels
► 2.15 ns typical propagation delay
► Typical jitter: 0.82 ps rms random, 40 ps total peak
► Lower power 1.8 V supplies
► ±8 kV IEC 61000-4-2 ESD protection across isolation barrier
► High common-mode transient immunity: 100 kV/μs typical
► Safety and regulatory approvals (28-lead SOIC_W_FP package)
► UL (pending): 5700 V rms for 1 minute per UL 1577
► CSA Component Acceptance Notice 5A (pending)
► VDE certificate of conformity (pending)
► DIN V VDE V 0884-11 (VDE V 0884-11):2017-01
► VIORM = 849 VPEAK (working voltage)
► Enable or disable refresh (low speed output correctness check)
► Operating temperature range: −40°C to +125°C
► 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3
mm creepage and clearance or 6 mm × 6 mm LFCSP package
with 1.27 mm creepage and clearance

APPLICATIONS
► Isolated video and imaging data
► Analog front-end isolation
► Data plane isolation
► Isolated high speed clock and data links
► Multi-gigabit serialization/deserialization (SERDES)
► Board-to-board optical replacement (for example, short reach fiber)