This trench Schottky rectifier in the dual flag SO−8 flat lead
package offers designers a unique degree of versatility and design
freedom. The two devices are electrically independent and can be used
separately, as common cathode, as common anode or in series as a
function of board level layout. The exposed pad design provides low
thermal resistance. The clip attach design creates a package with very
efficient die size to board area ratio. While thermal performance is
nearly the same as the DPAK package height and board footprint are
less than half.
Trench Schottky technology provides a superior forward voltage/
leakage tradeoff compared to planar Schottky. The reverse switching
characteristics are extremely stable over temperature minimizing
switching power loss in high frequency applications.

Features
• New Package Provides Capability of Inspection and Probe After
Board Mounting
• Low Forward Voltage Drop
• 175°C Operating Junction Temperature
• NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These are Pb−Free and Halide−Free Devices

Mechanical Characteristics:
• Case: Epoxy, Molded
• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
• Lead Finish: 100% Matte Sn (Tin)
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Device Meets MSL 1 Requirements
Applications
• Excellent Alternative to DPAK in Space−Constrained Automotive

Applications
• Output Rectification in Switching Power Supplies
• Freewheeling Diode used with Inductive Loads
• Automotive LED Lighting (Interior and Exterior)